Metal Bond Floor Polishing Pad

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BDT-D37 Metal Bond Floor Polishing Pads for Concrete

BDT-D37 Metal Bond Floor Polishing Pads for Concrete

More aggressive, better for chip removal. Mainly used for grinding of concrete floor. Advantage： 1.Aggressive and durable 2.high efficiency

  • Model： BDT-D37

Item No.:

BDT-D37

Products description:

HTC metal bond polishing pads for concrete, with double rhombus segments 

Segment size:

35*20*10mm

Grit:

6#, 16#, 30#, 60#, 120#, 200#,400#

Work Condition:

For wet grinding

Procession Object:

For grinding concrete