BDT-D14 3"Metal Bond Floor Polishing Pads for Concrete
More aggressive, better for chip removal. Mainly used for grinding of concrete floor. Advantage: 1.Aggressive and durable 2.high efficiency
- Model: BDT-D14
More aggressive, better for chip removal. Mainly used for grinding of concrete floor. Advantage: 1.Aggressive and durable 2.high efficiency
Item No.: | BDT-D14 |
Products description: | 3" Metal bond floor polishing pads with 10 segments 24*3.7/20*8mm, and 5/8-11" /M14 thread. |
Diameter: | 3" |
Segment size: | 24*3.7/20*8mm. |
Grit: | 6#, 16#, 30#, 60#, 120#, 200#,400# |
Back | 5/8-11" /M14 thread |
Work Condition: | For wet grinding |
Procession Object: | For grinding concrete |