BDT-D5 3"Metal Bond Floor Polishing Pads for Concrete
More aggressive, better for chip removal. Mainly used for grinding of concrete floor. Advantage： 1.Aggressive and durable 2.high efficiency
- Model： BDT-D5
Item No.: | BDT-D5 |
Products description: | 3" Metal bond floor polishing pads with 4 segments 30*12*8mm |
Diameter: | 3" |
Segment size: | 30*12*8mm |
Grit: | 6#, 16#, 30#, 60#, 120#, 200#,400# |
Back | Velcro |
Work Condition: | For wet grinding |
Procession Object: | For grinding conctrete |
subject
Brand AKG&HUAWEI
Specifications
Suitable model HUAWEI flat M3
Features M3 tablet customized AKG brand high fidelity headphones, with the M3 tablet to enjoy the HiFi sound quality
attribute
The length is 1100 + 43mm